国际学生入学条件
Undergraduate applicants who have no previous work at the post-secondary level must have at least a 2.5 grade point average (on a 4.0 scale) from a secondary school.
Official secondary school transcripts showing subjects, marks received and graduation date. If you have not yet graduated from secondary school, a transcript showing all completed work may be accepted for early admission.
TOEFL iBT - 70, TOEFL PBT - 525, IELTS - 6.0
SAT critical reading minimum score of 500 (SAT Taken Prior to March 2016)
SAT evidence based reading and writing minimum score of 550 (SAT Taken March 2016 and After)
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雅思考试总分
6.0
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雅思考试指南
- 雅思总分:6
- 托福网考总分:70
- 托福笔试总分:525
- 其他语言考试:Pearson (PTE) Academic score of 48<br>MELAB (Michigan English Language Assessment Battery) score of 74
CRICOS代码:
申请截止日期: 请与IDP顾问联系以获取详细信息。
课程简介
该领域的工程师设计,开发和测试新的材料技术,以帮助制造更好的医疗设备,制造更快的计算机芯片,设计更安全的汽车安全气囊等等。作为本课程的学生,您将研究许多不同类型的材料的特性,制造过程和行为,包括金属,陶瓷,聚合物,复合材料和混合系统,半导体,生物材料,纳米材料,航空航天和核材料。您将学习运用这些知识来改进或创建用于各种目的的新材料,并有机会在现代实验室中进行实验,包括用于半导体工艺培训的小型无尘室。
Engineers in this field design, develop and test new material technologies to help build better medical devices, create faster computer chips, design safer air bags for cars, and much more. As a student in this program, you will investigate the properties, fabrication processes, and behaviors of many different types of materials, including metals, ceramics, polymers, composite and hybrid systems, semiconductors, biomaterials, nanomaterials, aerospace and nuclear materials. You will learn to apply this knowledge to improve or create new materials for a variety of purposes, with opportunities to conduct experiments in modern labs, including a small-scale cleanroom for semiconductor process training.
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