国际学生入学条件
This program is open to graduates who have maintained a minimum average of B in each year of the BEng program in Electrical and Biomedical Engineering at McMaster University
One official transcript of academic work completed to date sent directly from the issuing institution If the final transcript does not show that a completed degree has been conferred an official copy of your diploma is also required If you do not have all grades please provide your most recent uptodate transcripts
Two confidential letters of recommendation from instructors who are most familiar with your academic work
Statement of Interest in pursuing graduate studies one page
Your CV Resume
Record of Landing for Permanent Residents ONLY Scan and upload the front and back of your card
TOEFL for the Faculty of Engineering a minimum score of 88 (internet based) or 213 on the (computer based) or 550 (paper based).
IELTS Academic minimum overall score of 6.5 with at least 5.5 in each section.
CAEL minimum overall score of 70 with at least 60 per band.
MELAB minimum score of 85.
York University course YUELI Level 6 with a minimum final grade of B.
University of Toronto course Academic Level 60 with a minimum final grade of B.
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雅思考试总分
6.5
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雅思考试指南
- 雅思总分:6.5
- 托福网考总分:88
- 托福笔试总分:550
- 其他语言考试:PTE Academic for the Faculty of Engineering - minimum score of 70.
CRICOS代码:
申请截止日期: 请与IDP顾问联系以获取详细信息。
课程简介
我们的工程学硕士(MEng)计划有两个相关目标。第一
McMaster's Electrical and Computer Engineering department is ranked as one of the best departments of electrical and computer engineering both nationally and internationally. Faculty members are regular award winners including the prestigious Premier Research Excellence Award (PREA), OCUFA teaching award, McMaster Students Union Teaching Award, Booker Gold Medal, and the Signal Processing Society Education Award.<br><br>McMaster's Department of Electrical & Computer Engineering is home to The Centre for Research in Micro- and Nano-systems, a unique facility in North America offering fabrication, characterization and integration of different materials, components and devices at multiple length scales. For example, Nano-Bonding and Interconnect System (NBIS) and Nanoimprinting Lithography System (NIL) provide fabrication and integration of nanometer scale structures and devices. Research using MNSL infrastructure spans from fundamental areas such as molecular interactions during bonding to applied relating to miniaturization of emerging systems for health and environmental applications.
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