全球制造系统工程技术工程学学士学位

Application, including the essay.

Official secondary transcripts (in language of original issue). Transcripts of all previously attended secondary schools, including dates of attendance, all sub-jects studied, grades earned and marks achieved on examinations, any tran-scripts not issued in English should be accompanied by a certified English trans-lation. Proof of completion must also be provided in the form of a graduation date listed on the transcript, a diploma, or a certificate of completion. If second-ary schooling is still in progress, this must be submitted as soon as completed and prior to enrollment at the University of Dayton.

These may be sent from the secondary school directly to the University of Day-ton via mail service to the address in the contact section on this page. Please note: If your institution is able to provide an e-transcript, please direct them to send the official link to: transcripts@udayton.edu. Please be aware, this does not include scanned, photocopied or emailed documents.

Letter of recommendation (optional). Letters may be sent to goglobal@udayton.edu directly from the recommender.

Test of English as a Foreign Language (TOEFL). A minimum score of 70 on the Internet-based (iB) test is required for full admission.

International English Language Testing System (IELTS). A minimum overall band score of 6.0 is required for full admission.

Pearson Test of English Academic (PTE). A minimum score of 50 is required for full admission.