博士先进的制造工艺可实现电力电子的异构集成

拉夫堡大学在研究强度（REF2014）方面是英格兰排名前十的大学，并且有资格提交给REF的拉夫堡学术人员中有66％的杰出工作被评为“世界领先”。或“国际一流”，而全国平均水平为43％。<br>在选择拉夫堡进行研究时，您将与该领域的领导者一起工作。您将受益于我们的全面支持和指导，包括量身定制的职业建议，以帮助您在研究和未来职业中取得成功。<br>项目详细信息：<br>功率器件的异构集成是指将单独制造的功率半导体，无源组件和控制元件组装到单个封装中，即总体上提供增强功能的系统级封装（SiP）。 ，提高了可靠性
Loughborough University is a top-ten rated university in England for research intensity (REF2014) and an outstanding 66% of the work of Loughborough's academic staff who were eligible to be submitted to the REF was judged as ‘world-leading' or ‘internationally excellent', compared to a national average figure of 43%. In choosing Loughborough for your research, you'll work alongside academics who are leaders in their field. You will benefit from comprehensive support and guidance from our , including tailored careers advice, to help you succeed in your research and future career. Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e. System in Package (SiP) that, in the aggregate, provides increased functionality, enhanced reliability and reduced cost. The integration of the next generation wide-band gap (WBG) power devices has, nevertheless, been bottlenecked by prevailing manufacturing technologies, which are unlikely to offer a cost-effective way of implementing the necessary 3D structures needed to contain the electromagnetic interference (EMI), address the thermal integration issues and offer a more robust and reliable packaging solution. This PhD project will focus on the development of novel structural embedding methodology and 3D multi-material architecture, using various processing methods such as subtractive lithography, additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating) and precision micro-machining, and with emphasis on the thermal and electrical reliability of the integration system. Successful candidates will join an interdisciplinary team with substantial industrial exposure and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future high value added hybrid electronics.