国际学生入学条件
Applicants should have, or expect to achieve, a First Class Honours degree (or equivalent) in mathematics, physics, aeronautics or a related field.A relevant Master's degree and / or experience in one or more of the following will be an advantage:
Computer programming
Computational Fluid Dynamics
Linear Algebra
Time-series analysis (wavelets and Fourier methods)
IELTS: 6.5 Overall with 6.0 in each individual element.
TOEFL iBT: Overall score of 92, with not less than 22 in each test
TOEFL pBT: 160
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雅思考试总分
6.5
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雅思考试指南
- 雅思总分:6.5
- 托福网考总分:92
- 托福笔试总分:160
- 其他语言考试:Pearson Test of Academic English (PTE): 62 overall with no less than 55 in all subtests
CRICOS代码:
申请截止日期: 请与IDP顾问联系以获取详细信息。
课程简介
拉夫堡大学在研究强度(REF2014)方面是英格兰排名前十的大学,并且有资格提交给REF的拉夫堡学术人员中有66%的杰出工作被评为“世界领先”。或“国际一流”,而全国平均水平为43%。<br>在选择拉夫堡进行研究时,您将与该领域的领导者一起工作。您将受益于我们的全面支持和指导,包括量身定制的职业建议,以帮助您在研究和未来职业中取得成功。<br>项目详细信息:<br>电力电子技术广泛用于电动和混合动力汽车(EHV),航空航天器,可再生能源组件和牵引力控制系统。当前,功率模块构造的快速发展在某种程度上受到高开
Loughborough University is a top-ten rated university in England for research intensity (REF2014) and an outstanding 66% of the work of Loughborough's academic staff who were eligible to be submitted to the REF was judged as ?world-leading? or ?internationally excellent?, compared to a national average figure of 43%.<br>In choosing Loughborough for your research, you'll work alongside academics who are leaders in their field. You will benefit from comprehensive support and guidance from our , including tailored careers advice, to help you succeed in your research and future career. <br>Project detail:<br>Power electronics are widely used in electric and hybrid vehicles (EHV), aerospace crafts, renewable power components and traction control systems. At present, the rapid development in construction of power modules which is somewhat restricted by high switching frequency, high reliability and low loss requires heterogeneous integration. The uses of Wide Band Gap (WBG) such as SiC devices are also limited by the packaging technologies. This demands a cost effective route of implementing the necessary 3D structures needed to contain the EMI, address the thermal management and offer a more robust and reliable packaging solution. This PhD project will focus on the packaging and integration technologies through the use of functional intermediate layers to enhance electrical, thermal and mechanical performance enabling a timely need to make a leap forward for the future use of these devices. This will be achieved by the development of different functional inter-layers and heterogeneous integration to enable robust multi-material, multi-functional embedded structures. Numerical modelling as well as materials characterisation techniques will be utilised to qualify the functionalised surfaces as well as the resultant interfaces in the course of interaction and evolution of the integrated structures. Successful candidates will join an interdisciplinary team with substantial industrial engagement and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future enabling technologies for wide range of power electronics devices.
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