多核软错误评估和管理技术的博士学位探索

拉夫堡大学在研究强度（REF2014）方面是英格兰排名前十的大学，并且有资格提交给REF的拉夫堡学术人员中有66％的杰出工作被评为“世界领先”。 €™或“国际一流”，而全国平均水平为43％。项目详细信息：多核处理器是汽车，医疗设备，高性能计算（HPC）等许多工业领域的重要组成部分和航天器。在业界领先的工艺技术节点上制造的多核系统中，软错误的出现是一个重要且日益增长的可靠性问题，在多个领域。<br>尽管在飞行过程中每天观察到多达数百个软错误，在不久的将来，预计每天在地面运行的航天器，电子计算系统至少会遇到一
Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e. System in Package (SiP) that, in the aggregate, provides increased functionality, enhanced reliability and reduced cost. The integration of the next generation wide-band gap (WBG) power devices has, nevertheless, been bottlenecked by prevailing manufacturing technologies, which are unlikely to offer a cost-effective way of implementing the necessary 3D structures needed to contain the electromagnetic interference (EMI), address the thermal integration issues and offer a more robust and reliable packaging solution. This PhD project will focus on the development of novel structural embedding methodology and 3D multi-material architecture, using various processing methods such as subtractive lithography, additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating) and precision micro-machining, and with emphasis on the thermal and electrical reliability of the integration system.