国际学生入学条件
Official copies of all academic transcripts from secondary schools, with English translations.
Test of English as a Foreign Language (TOEFL) : Rensselaer expects a minimum TOEFL score of at least 88 iBT or 570 PBT
International English Language Testing System (IELTS) : Rensselaer expects a band score of at least 7.0
Duolingo English Test (DET): Rensselaer expects a minimum score of 115
Pearson's Test of English (PTE): a PTE score of at least 59 is expected
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雅思考试总分
7.0
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雅思考试指南
- 雅思总分:7
- 托福网考总分:88
- 托福笔试总分:570
- 其他语言考试:Duolingo English Test (DET): Rensselaer expects a minimum score of 115<br>Pearson's Test of English (PTE): a PTE score of at least 59 is expected
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课程简介
The development of advanced computer systems and their interconnection to facilitate ubiquitous and pervasive computing capabilities is the primary focus of this group. Research topics related to the design, implementation, layout, and testing of hardware systems include the design and testing of digital and mixed-signal chips in CMOS and BiCMOS and the development of computer-aided design tools for such designs. Specific topics include the development of high-speed computer chips using SiGe BiCMOS technology, the design and testing of mixed-signal chips for communications applications, the influence of three-dimensional (3D) integration/packaging on computer design, and the development of techniques for the design and reliable operation of digital chips fabricated in deep submicron CMOS.<br><br>Other ongoing research activities include error correcting coding system design and VLSI implementation for magnetic and holographic storage, and fiber and wireless communication, algorithm/architecture co-design for wireless multi-antenna signal processing, fault tolerance for semiconductor memories and molecular nanoelectronic memory, signal processing algorithm/architecture co-design for defect/variation tolerance in end-of-the-roadmap CMOS and post-silicon nanoelectronics regimes, silicon-based radio-frequency power amplifiers, multi-Gb/s broadband communications circuits, wafer-level 3D integration for millimeter-wave smart antenna transceivers, RF-powered wireless communication circuits for bio-implantable microsystems, devices, circuits, systems, algorithms, and methodologies to enable intelligent yet inexpensive portable platforms for environmental and biomedical diagnostics, detection and quantification of low levels of biological signals reliably, conveniently, safely, and quickly.
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